Under
Secretary Phillip J. Bond of the U.S. Department of Commerce
visited Uruguay.
With the purpose of
strengthening the high technology in the hemisphere, Under
Secretary Phillip J. Bond of the U.S. Department of Commerce
visited Uruguay on Monday, June 2.
The U.S. official’s agenda included
meetings with different representatives of the Uruguayan Government
and Parliament, as well as with members of the private sector
and academic community. His tour to the region also included
a visit to Brazil.
“The countries in the region are key
commercial partners of the United States,” Bond said.
He also added “the strengthening of the relationships
with the Governments and private sectors in the region will
allow countries to work closely to expand trade and growth
of technology sectors, and improve the quality of life of
people, making technology more accessible.”
In his meetings, Bond discussed issues related
to Secretary of Commerce Donald Evan’s efforts to reduce
trade barriers in the global market, and initiatives being
implemented by the National Institute of Standards and Technology
(NIST) and the International Trade Administration.
Additional topics of discussion on Bond’s
agenda included intellectual property and transparency in
business practices, e-government, e-commerce, technology corporations
and the status of biotechnology and other research in the
region.
Phillip J. Bond was sworn in as Under Secretary
of Commerce for Technology on October 30, 2001. He was nominated
by President George W. Bush on September 4, and confirmed
by the United States Senate on October 23, 2001.
Secretary Evans announced on January 22, 2002,
that he had chosen Bond to serve as his Chief of Staff as
well, stating that he viewed technology policy as a top priority
in his mission to advocate for American business. Bond's appointment
would ensure that the Department will continue to focus on
technology as a vital component of the U.S. economy.
Some of the high priority issues that he is
involved in include support for American innovation and entrepreneurship,
the emerging field of nanotechnology, strengthening U.S. technology
cooperation with other countries, especially in areas such
as standards development, education and training of a high
tech workforce, and an array of issues of concern to the telecommunications
and information technology industries.
Mr. Bond is a graduate of Linfield College
in Oregon.
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