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Under Secretary Phillip J. Bond of the U.S. Department of Commerce visited Uruguay.

 
Posted: June 6, 2003

With the purpose of strengthening the high technology in the hemisphere, Under Secretary Phillip J. Bond of the U.S. Department of Commerce visited Uruguay on Monday, June 2.

The U.S. official’s agenda included meetings with different representatives of the Uruguayan Government and Parliament, as well as with members of the private sector and academic community. His tour to the region also included a visit to Brazil.

“The countries in the region are key commercial partners of the United States,” Bond said. He also added “the strengthening of the relationships with the Governments and private sectors in the region will allow countries to work closely to expand trade and growth of technology sectors, and improve the quality of life of people, making technology more accessible.”

In his meetings, Bond discussed issues related to Secretary of Commerce Donald Evan’s efforts to reduce trade barriers in the global market, and initiatives being implemented by the National Institute of Standards and Technology (NIST) and the International Trade Administration.

Additional topics of discussion on Bond’s agenda included intellectual property and transparency in business practices, e-government, e-commerce, technology corporations and the status of biotechnology and other research in the region.

Phillip J. Bond was sworn in as Under Secretary of Commerce for Technology on October 30, 2001. He was nominated by President George W. Bush on September 4, and confirmed by the United States Senate on October 23, 2001.

Secretary Evans announced on January 22, 2002, that he had chosen Bond to serve as his Chief of Staff as well, stating that he viewed technology policy as a top priority in his mission to advocate for American business. Bond's appointment would ensure that the Department will continue to focus on technology as a vital component of the U.S. economy.

Some of the high priority issues that he is involved in include support for American innovation and entrepreneurship, the emerging field of nanotechnology, strengthening U.S. technology cooperation with other countries, especially in areas such as standards development, education and training of a high tech workforce, and an array of issues of concern to the telecommunications and information technology industries.

Mr. Bond is a graduate of Linfield College in Oregon.



 

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